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l Design and analysis of advanced components for microwave and millimeter-wave applications.

    - Design of innovative active and passive components for MMIC applications.

    - Development of innovative components based on CMOS, SiGe, GaAs and InP technologies. 

    - Establishment of measurement and characterization scheme for building blocks.

lSystem-On-Chip (SOC) design and integration for communication applications

- System planning of wireless communication circuits.

- Signal integrity and EMI evaluation for SOC.

- Development of SOC based on CMOS technologies.

l  Design and analysis of power amplifier for wireless communication applications.

    - Design of high power amplifier based MMIC technologies or PCB hybrid technologies for analog and digital modulation applications.

    - Characterization and analysis of nonlinear characteristics for high power amplifier or transmitter, and development linearization scheme for high-linearity system.

    - Establishment of test bench for high power amplifier in microwave and millimeter-wave regime.

lMicrowave and millimeter-wave system design and integration.

    -Development of building block modules for communication with higher level of integration.

    -Analysis of the signal integrity and EMI effects for the housing evaluation and providing design strategies for preventing them in the initial design.

    - Development of measurement scheme for evaluation and verification.

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