李進福 (Jin-Fu Li)
學術專長與研究興趣:
- 人工智慧(AI)/物聯網(IoT)電路與系統設計
- 記憶體內運算(In-Memory Computing)
- 半導體記憶體設計與測試
- 三維積體電路/SOC設計與測試
現職與經歷:
- 中央大學電機工程學系 特聘教授(2019/01~)
- 中央大學 副研發長(2019/02~2025/01)
- 中央大學電機工程學系 教授(2009/08~2018/12)
- 中央大學電機工程學系 系主任(2013/08~2016/07)
- 中央大學電機工程學系 副系主任(2010/08~2013/07)
- 中央大學電機工程學系 副教授(2005/08~2009/07)
- 中央大學電機工程學系 助理教授(2002/08~2005/07)
- 台灣積體電路設計學會 (TICD) 理事 (2024/08~)
- 中國工程師學會 教育委員會委員(2025/02-2026/12)
- 工業技術研究院資通所 兼任特聘研究員(2010/01~2010/12)
- 工業技術研究院電光所 兼任特聘研究員(2024/04~2024/12 )
- 加州大學聖塔芭芭拉校區電機與電腦工程學系 訪問學者(2006/07~2007/05)
- 教育部顧問室教改計畫SOC總聯盟前瞻教學平台辦公室 執行秘書(2005~2006)
- 社團法人台灣評鑑協會 評鑑委員 (2020)
- 科技部微電子學門專題計畫---審議委員(2019~2021)
- IEEE Design & Test, Editorial Board Member (2015~)
- 中華民國證券櫃檯買賣中心 上櫃審議委員 (2014~)
學歷:
- 清華大學電機工程學系 博士(1999/09~2002/07)
- 清華大學電機工程學系 碩士(1997/09~1999/06)
- 台灣工業技術學院電機工程學系 學士(1991/09~1995/06)
榮譽:
- 中央大學特聘教授(2019)
- 中國電機工程師學會(CIEE)傑出電機工程教授獎 (2015)
- 2013 IEEE VLSI Test Symposium Best Special Session Award (2014)
- 科技部優秀年輕學者計畫 (2013~2016)
- 第十二屆旺宏金矽獎(晶片設計)優勝獎 (2012)
- 99、106、108年度校教學傑出暨優良獎-院教學優良獎 (2011, 2018, 2020)
- 台灣積體電路設計(TICD)學會傑出年輕學者獎(2010)
- CIC晶片製作優良設計獎 (2010)
- CIC晶片製作佳作設計獎 (2009)
- 中央大學傑出研究獎 (2008~2018)
- 中國電機工程師學會(CIEE)優秀青年電機工程師獎 (2008)
- 96及99年度中央大學校優良導師獎 (2008, 2011)
- 菁英留學計畫--教育部九十三年度『國內大學校院自行選送人才出國研修』公費留學補助 (2005)
- 台灣積體電路設計學會(TICD)博士論文獎(2003)
- 教育部產學合作獎(2003)
- 高雄市立高雄高工傑出校友(2010)
- 屏東縣新園國中傑出校友(2018)
- 台灣東電化獎學金 (1994)
專業服務經驗:
- 會議大會主席、議程主席、Track Chair:
- Program Chair of 2010 VLSI Test Technology Workshop (VTTW 2010), YiLan, Taiwan
- General Chair of 2011 VLSI Test Technology Workshop (VTTW 2011), NanTou, Taiwan
- Program Chair of 2013 VLSI Design/CAD Symposium, Kaohsiung, Taiwan
- Contest Co-Chair of 2014 CAD Contest at ICCAD, San Jose, CA, USA
- Track Chair of 2012 and 2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS). (Track of Testing Technology)
- Track Chair of 2017 IEEE Asia and South Pacific Design Automation Conference (ASP-DAC). (Track of Test and Design for Testability)
- Program Chair of 2017 IEEE Asian Test Symposium, Taipei, Taiwan
- Track Chair of 2018 IEEE Asia and South Pacific Design Automation Conference (ASP-DAC). (Track of Test and Design for Testability)
- General Chair of 2022 IEEE Asian Test Symposium, Taiwan
- General Chair of 2023 VLSI Design/CAD Symposium, Kaohsiung, Taiwan
- Tutorial Chair of 2024 IEEE VLSI-DAT, Hsinchu, Taiwan.
- Steering Committee Member of IEEE Asian Test Symposium, 2023~
- 兼任顧問:
- 華邦電子股份有限公司兼任顧問 (2021/01~)
- 納星科技股份有限公司兼任顧問(2010/01~2010/07)
- 財團法人工業技術研究院系統晶片科技中心兼任顧問(2009/06~2009/12)
- 國立清華大學積體電路設計技術研發中心『前瞻網路安全處理器及相關SOC設計與測試技術研發三年計畫』兼任顧問(2002/09-2003/05)
- 受邀演講:
- 輔仁大學電子系 (Talk:Yield-Enhancement Techniques for RAMs)
- 勤益技術學院電子系 (Talk:Yield-Enhancement Techniques for RAMs)
- Dept. of ECE, UCSB (Talk: Memory Built-In Self-Repair, 2007)
- 2008 EDA workshop (Talk: ITC技術趨勢與心得分享)
- 經濟部工業局半導體產業推動辦公室(Talk: Architecture Design and Test of 3D Memories, 2009/05)
- 台灣科技大學電機系(Talk: 3D Integration System Chips---Opportunities and Challenges,
2010/03)
- 清華大學電機系(Talk: RAM Test Algorithms, 2010/03)
- 元智大學電機系(Talk: 3D Integration System Chips---Opportunities and Challenges, 2010/04)
- 工研院資通所(Talk: Testing of TSV-Based 3D ICs, 2010/05)
- 工研院資通所(Talk: Extensions of Current Test Standards for 3D ICs, 2010/09)
- 中原大學電子系(Talk: Introduction to 3D Integration Technology Using TSV, 2011/03)
- 工研院資通所(Talk: Challenges and Strategies of Testing and Repair for 3D RAMs, 2011/10)
- TSMC (Invited Talk on RD/DTP Technical Forum, Topic: Test and Yield-Enhancement Techniques for 3D ICs, 2012/05)
- EDA Forum(Talk: Test and Yield-Enhancement Techniques for 3D ICs, 2012/05)
- 工研院資通所策略規劃會議專題演講(Talk: Benefits and Applications of 3D ICs, 2012/07)
- 7th VLSI Test Technology Workshop (Invited Talk: Yield-Enhancement Techniques for 3D ICs, 2013/07)
- Taiwan Tech and Kyutech Advanced VLSI Testing Workshop (Invited Talk: Built-In Self-Repair Scheme for 3D RAMs, 2013/09)
- 台灣大學電子所 (Talk: Yield-Enhancement Techniques for 3D ICs, 2014/05)
- Kyutech, UT, and Taiwan Tech Joint Workshop (Invited Talk: Hybrid BIST Scheme for DRAMs, 2015/03)
- IMEC, Belgium (Talk: NCU's Research Activities in IC Design, 2016/05)
- Kyutech, UT, and Taiwan Tech Joint Workshop (Invited Talk: A BISR Scheme for DRAMs with Spares Using Hybrid Reconfiguration Mechanism, 2016/09)
- 清華大學資工系(Talk: Trend of System Architectures: Near-Data Processing, 2016/12)
- 工研院資通所(Talk: Low-Energy Design Techniques for Convolutional Neural Network, 2017/03/07)
- 工研院資通所(Talk: Overview of VLSI Hardware for Convolutional Neural Network, 2017/03/10)
- 淡江大學電機系(Talk: Low-Energy Design Techniques for Deep Neural Networks, 2017/11/22)
- 中正大學資工系(Talk: Low-Energy Design Techniques for Deep Neural Networks, 2018/01/08)
- AI Computing Workshop (Talk: ECC-Based Refresh Power Reduction Technique for DRAMs of DNN Systems, 2018/07/09)
- 台大電子所EDA Seminar(Talk: ECC-Based Refresh Power Reduction Technique for DRAMs of DNN Systems, 2019/03/18)
- 輔大電機系(Talk: Hybrid Voting and ECC Refresh Power Reduction Method for DRAMs of DNN Systems, 2020/03/25)
- 2020 VLSI Test Technology Workshop (VTTW) (Keynote: Leveraging Intrinsic Fault Tolerance of Neural Network for Designing Acceleration Systems: Opportunities and Challenges, 2020/07/28)
- 芯測(Talk: Testing of ReRAM and In-Memory Computing Memories, 2020/12/1)
- 華邦電子(Talk: Testing of In-Memory Computing Memories, 2020/12/22)
- 華邦電子(Talk: Redundancy Analysis Algorithms for Memory Repair, 2021/2/2)
- 華邦電子(Talk: Test and Yield-Enhancement Techniques for 3D ICs, 2021/3/23)
- 華邦電子(Talk: Test Algorithms and BIST Design for DRAMs, 2021/4/27)
- 華邦電子(Talk: Testing of Flash Memories, 2021/5/25)
- 華邦電子(Talk: Test Data Analysis for Test Time Reduction and Yield Improvement, 2021/7/6)
- Mediatek (Talk: Test Challenges and Strategies for Chiplet-based ICs, 2022/07/05)
- 台大重點科技研究院(Talk: Testing and Reliability of Computing-In Memories, 2023/03/13)
- 學術會議授課(Tutorial Speaker):
- VTTW 2007 (Topic: Yield and Reliability-Enhancement Techniques for RAMs)
- IEEE Asia and South Pacific Design Automation Conference 2010 (Embedded tutorial: Is 3D Integration an Opportunity or Just a Hype?)
- IEEE International Test Conference in Asia (ITC-Asia) 2017 (Embedded tutorial: Deep Neural Network Design and Applications on Testing)
- IEEE International Test Conference in Asia (ITC-Asia) 2020 (Tutorial: Testing of In-Memory-Computing Memories)
- 學術會議座談引言人(Panelist):
- VTTF2003測試產學座談 (Topic: 晶片偵錯之挑戰與回應)
- VTTF2007 (Topic: How do you improve your research publications? Organizer: Prof. Cheng-Wen Wu)
- VTTF2008測試產學座談 (Topic: SiP Test: Issues and Challenges)
- VTTF2009測試產學座談 (Topic: Challenges and Strategy in KGD Test)
- IEEE Asian Test Symposium 2009 (Topic: Testing embedded memories in the nano-era: will the existing approaches survive? Organizer: ir. Said Hamdioui; Panelists: Cheng-Wen Wu, Ad J. van de Goor, Shianling Wu, and Jin-Fu Li)
- VTTF2012 (Topic: 如何當一位好的學術單位主管? Organizer: Prof. Cheng-Wen Wu)
- VLSI Test Technology Workshop 2012 (Topic: Is BIST in more demand? Organizer: Prof. Mango C.-T. Chao; Panelist: Kwang-Ting Tim Cheng, Rei-Fu Huang, Ting-Pu Tai, Soon-Jyh Chang, Jin-Fu Li)
- TICD 101年第二次測試策略產學座談會 2012(Topic: Evolution and Challenges of 3D IC Testing)
- VTTF 2015/09 (Topic: Why PhD Students Are Vanishing? Organizer: Prof. Cheng-Wen Wu; Panelist: Ming-Der Hsieh, Jin-Fu Li, and Po-Yuan Chen)
- 學術會議議程委員(Technical Program Committee Member):
- Intelligent Living Technology Conference, 2006, 2011, and 2012
- National Computer Symposium, 2007
- IEEE International Symposium on Computer, Consumer and Control (IS3C), 2012
- IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2012 and 2014
- IEEE TENCON 2012
- IEEE Asia Symposium on Quality Electronic Design (ASQED), 2015
- IEEE International Conference on VLSI Design, 2016~2017
- IEEE International Conference on Embedded Systems, 2016~2017
- VLSI Test Technology Workshop (VTTW), 2008~
- VLSI Design/CAD Symposium, 2014~
- IEEE Asian Test Symposium (ATS), 2009, 2013~
- IEEE Asia and South Pacific Design Automation Conference (ASP-DAC), 2011, 2017~2019
- International Conference on Parallel Computing (ParCo), 2011~
- IEEE International Symposium on Quality Electronic Design (ISQED), 2015~
- IEEE International Test Conference in Asia (ITC-Asia), 2017~
- IEEE International Conference on Computer Aided Design (ICCAD), 2018~2019
- IEEE VLSI Test Symposium (VTS), 2020~
- IEEE International Test Conference (ITC), 2022~
- IEEE VLSI-DAT, 2024~
- 學術會議Special Session & Panel Organizer:
- IEEE Asia and South Pacific Design Automation Conference (ASP-DAC) 2010 (Topic: Is 3D Integration an opportunity or just a hype; Orgnizers: Cheng-Wen Wu and Jin-Fu Li)
- TICD 101年第一次測試策略產學座談會(Topic: Test and Reliability Challenges of Logic-Memory Stacked 3D ICs)
- IEEE VLSI Test Symposium (VTS) 2013 ( Hot Topic: 3D-IC Design and Test; Organizers: Jin-Fu Li and Cheng-Wen Wu)
- IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2014 (Special Session: 2014 CAD Contest; Organizers: Iris Hui-Ru Jiang, Natarajan Viswanathan, Tai-Chen Chen, and Jin-Fu Li)
- Organizer of Industry Session of 2015 IEEE Internatioanl Symposium on VLSI Design, Automation and Test (VLSI-DAT)
- Organizer of 2022 IEEE ITC-Asia Special Session (Session Title: Test and Reliability of Computing-in-Memories)
- Organizer of Special Session entitled "Testing, Reliablity, and Hardware Security of Computing-in Memories" in the 36th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), Juan-Les-Pins, France, 2023.
- 學術會議組織委員(Organization Committee Member):
- 第十六屆VLSI/CAD研討會之課程主席(2005)
- Publication Chair of IEEE Int'l Workshop on Memory Technology, Design, and Testing(2005、2006、2009)
- 學術會議Talks與Technical Session主持人:
- VLSI/CAD Technical Session Chair(2005, 2010)
- 2008 IEEE International Workshop on Memory Technology, Design, and Testing (Session Chair)
- 2008/2009/2017 VLSI Test Technology Workshop (Session Chair)
- 2009 IEEE International Workshop on Memory Technology, Design, and Testing (Chair of Invited Talk)
- 2011 IEEE Internatioanl Symposium on VLSI Design, Automation and Test (VLSI-DAT) (Session Chair)
- 2016 IEEE Asian Test Symposium (Session Chair)
- 2017 IEEE International Test Conference in Asia (Session Chair)
- 2018 IEEE Asian Test Symposium (Session Chair)
- 教育部計畫:
- 教育部前瞻晶片系統設計人才培育先導型計畫—前瞻課程非同步教材製作計畫(測試課程—半導體記憶體測試)(2007~2009)
- 教育部顧問室超大型積體電路教育改進計畫--DAT聯盟SiP設計自動化課程主持人(2008~2011)
- 教育部顧問室超大型積體電路教育改進計畫--DAT聯盟學生學習論壇主持人(2008~2011)
- 國際積體電路電腦輔助設計軟體製作競賽主持人 (2014)
- 學術組織會員及委員:
- IEEE及IEEE Computer Society 會員 (2003~)
- 中國電機工程學會永久會員
- 台灣積體電路設計學會永久會員
- VLST Test Technology Forum(VTTF)會員
- 經濟部半導體產業推動辦公室3D IC Test SIG會員 (2009~2011)
- 經濟部半導體產業推動辦公室3D IC SIG--3D IC Forum榮譽會員 (2010)
- 中國電機工程學會論文委員會委員(2014~2019)
- 中央大學電機系IC設計產業研究碩士專班主持人(2006.02~2008.01)
- 經濟部半導體產業推動辦公室3D IC Test SIG:Chair of Test Interface WG (2009~2010)
- 校外授課:
- 中原大學資工系 (Short Course: SOC Testing)
- 清華大學電機系 (Short Course: Memory Built-In Self-Repair; Content Addressable Memory Testing; RAM Fault Models and Test Algorithms)
- 台灣大學電子所 (Short Course: Memory Testing)
- 自強基金會 (Short Courses: Memory Testing, Memory Built-In Self-Repair, VLSI Design, etc.)
- 台大慶齡中心 (Short Courses: SOC Testing, VLSI Design)
- 華邦電子教育訓練課程(自強基金會主辦)
- EDA聯盟課程發表 (Short Course: Yield and Reliability Enhancement Techniques for RAMs, 2005)
- 納星科技股份有限公司 (Course: Semiconductor Memory Testing, 2010)
- 工研院資通所(Course: Design-for-Testability of VLSI Circuits, 2011)
- 聯詠科技股份有限公司 (Course: Built-In Self-Test/Self-Diagnosis for RAMs, 2011)
- 聯詠科技股份有限公司 (Course: SRAM Architecture, BIST, and BISR, 2012)
- 工研院資通所(Course: VLSI Testing, 2014)
- 交大電子系人才培訓中心(Course: SOC & 3D IC Test Architectures, 2015)
- 聯詠科技股份有限公司 (Course: Design-for-Testability Techniques for Digital Circuits and Memories, 2015)
- 交大電子系人才培訓中心(Course: SOC & 3D IC Test Architectures, 2016)
- 交大電子系人才培訓中心(Course: Embedded Memory Testing and Repair, 2016)
- 交大電子系人才培訓中心(Course: Embedded Memory Testing and Repair, 2017)
- 力晶科技(Course: Testing for Digital Circuits, 2017)
- 自強基金會-晉江(Course: Embedded Memory Testing, 2017)
- 英特爾創新科技股份有限公司(Course: Testing of Integrated Circuits, 2022)
- 指導學生獲獎:
- 獲思源科技教育基金會(思源科技股份有限公司贊助) IEEE International Test Conference (ITC) 論文獎 (2006)
- 95年度大學院校矽智產(SIP)設計競賽佳作 (2007)
- European Test Symposium (ETS) 2006論文被IET Proc. Computers and Digital Techniques期刊選為Best Selected Papers from ETS'06 (2007)
- 獲思源科技教育基金會(思源科技股份有限公司贊助) IEEE International Test Conference (ITC) 論文獎 (2008)
- CIC晶片製作佳作設計獎 (2009)
- CIC晶片製作優良設計獎 (2010)
- 指導學生陳亭如獲得99年度台灣積體電路設計學會碩士論文獎(2011)
- 指導學生曾子維獲得100年度台灣積體電路設計學會博士論文獎(2012)
- 指導學生侯致聖獲得第十二屆旺宏金矽獎優勝獎(2012)
- 指導學生周哲緯獲得102年度台灣積體電路設計學會碩士論文獎(2014)
- 指導學生張志銘及李亭慧獲得2015國際積體電路電腦輔助設計(CAD)軟體製作競賽國內賽優等(2015)
- 指導學生鄭佳文、璩瑋、王培馨獲得104學年度中央大學資電學院專題競賽優等,題目:物聯網--智慧紅綠燈(2016)
- 指導學生田繹、浦敬群獲得104學年度中央大學資電學院專題競賽佳作,題目:車聯網--防追撞裝置(2016)
- 指導學生謝明澔、陳涵均、李蕎芸獲得106學年度中央大學資電學院專題競賽優等,題目:聽見你的真心(2018)
- 指導學生江子杰獲得106學年度中央大學資電學院專題競賽佳作,題目:深度神經網路模型的加速與壓縮---單神經元獨立壓縮法 (2018)
- 指導學生蔡采玲獲得 2019 IEEE Defect and Fault Tolerance on VLSI Systems and Nanotechnology Symposium--Best Student Papers Award (2019)
- 指導學生何芝儀、蕭瑋誠獲得108學年度中央大學資電學院專題競賽優勝,題目:看見手語的聲音---手語及時辨識APP (2020)
- 指導學生王綰晴、李相程、李庭緯獲得108學年度中央大學資電學院專題競賽佳作,題目:浪北鼻回家 (2020)
- 指導學生李冠霈、林妤蒨獲得2020新創千里馬電梯簡報潛力獎,題目:動眼科技(2020)
- 指導學生王綰晴、李相程、李庭緯獲得2020新創千里馬電梯簡報潛力獎,題目:浪北鼻回家 (2020)
- Chih-Li Hsiao, Hsiu-Wei Chen, Shih-Hsu Huang, and Jin-Fu Li,"A Machine Learning-based power prediction framework for DCIM circuits", COOL Chips 28, 2025 (Best Poster Award).